Precision and complex packaging SMD PCBA OEM
The product's chip components are precisely packaged and come in many varieties. The smallest chip component package is 01005, and the BGA ball pitch can be up to 2.0mm. The product has high requirements for cleanliness and the quality of welding accessories. It tests process control and technical capabilities, and has high requirements for the processing accuracy of related equipment on the chip production line.
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Keywords:
Onte Electronic Technology
PCBA comprehensive solution
Precision and complex packaging SMD PCBA OEM
The product's chip components are precisely packaged and come in many varieties. The smallest chip component package is 01005, and the BGA ball pitch can be up to 2.0mm. The product has high requirements for cleanliness and the quality of welding accessories. It tests process control and technical capabilities, and has high requirements for the processing accuracy of related equipment on the chip production line.
SERVICE COMMITMENT
R&D Cooperation
8-hour response, 24-hour standby
Product Quality
100% qualified rate of finished products
Order delivery time
Strictly follow customer requirements
After-Sale Service:
8-hour response, 24-hour standby
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