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Precision and complex packaging SMD PCBA OEM


The product's chip components are precisely packaged and come in many varieties. The smallest chip component package is 01005, and the BGA ball pitch can be up to 2.0mm. The product has high requirements for cleanliness and the quality of welding accessories. It tests process control and technical capabilities, and has high requirements for the processing accuracy of related equipment on the chip production line.

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Products

Keywords:

Onte Electronic Technology

PCBA comprehensive solution

Introduce

Precision and complex packaging SMD PCBA OEM

The product's chip components are precisely packaged and come in many varieties. The smallest chip component package is 01005, and the BGA ball pitch can be up to 2.0mm. The product has high requirements for cleanliness and the quality of welding accessories. It tests process control and technical capabilities, and has high requirements for the processing accuracy of related equipment on the chip production line.

SERVICE COMMITMENT


R&D Cooperation

8-hour response, 24-hour standby

Product Quality

100% qualified rate of finished products

Order delivery time

Strictly follow customer requirements

After-Sale Service:

8-hour response, 24-hour standby

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The product production process is complex, the plug-in components have large packaging volume, high heat capacity and fast heat absorption, the thermal management control precision standards of THT welding equipment are high, the production processes are numerous and complex, and the product welding quality and reliability requirements are high.

Precision and complex packaging SMD PCBA OEM


The product's chip components are precisely packaged and come in many varieties. The smallest chip component package is 01005, and the BGA ball pitch can be up to 2.0mm. The product has high requirements for cleanliness and the quality of welding accessories. It tests process control and technical capabilities, and has high requirements for the processing accuracy of related equipment on the chip production line.

Multi-layer, large-size PCBA OEM and OEM


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Due to the soft irregular shape, the mounting process needs to ensure the flatness and consistency of the FPC, which requires high precision of the production fixture and precise control of the welding temperature.

Global partners


Our printed circuit board assembly (PCBA) and box build services are widely trusted by global customers for many years.

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