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Quality Assurance
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Germany Phoenix-X-Ray Nondestructive Testing
X-Ray inspection equipment (Phoenix PCBA ANALYER, Germany)
Used for BGA, AQFN, CSP and other packaging components that cannot be inspected by naked eyes after welding, such as solder joint defects, internal wire breakage of the chip body, LED wick defects, etc.
• 160KV open tube, more accurate than closed tube detection, clearer image.
• Focus 2u, geometric magnification 2060 times, system magnification 12800 times.
• Stage 360° rotation, five-axis linkage CNC system, image detector maximum 60° rotation.
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